I thought of interdiffusion and building up of an intermetallic transition Zone (TiAu2, TiAu,...).
But this happens properly only at higher temperatures ?
Could you give me a reference for metallic bonding as the adhesion mechanism in the Ti-Au-System ?
Thanks a lot.
Best regards
Hi all,
I sputtered titanium (10 nm) - gold (~ 100 nm) films at room temperature on
oxidized silicon substrates. The titanium acts as an adhesion promoter between the SiO2
and the gold film.
My Question:
What is the adhesion mechanism between the titanium and gold film at room temperature...
Hi all,
I would like to deposit a thin titanium film (d=100nm) with pvd sputtering on an epoxy encapsulated
IC-chip to protect the chip against corrosive gases.
Titanium target (diameter: 100mm) is straight above IC-Chip (length and width: 6mm, height:2mm), working pressure ~ 1E-4 mbar.
My...